Broadcom to tap corporate bond market for funds to pay down debt 26 de setembro de 2024 by in News Semiconductor company last issued bonds in July, when it raised $5 billion to refinance loans taken on to pay for its $69 billion acquisition of VMware Inc. Compartilhe isso:Clique para compartilhar no Twitter(abre em nova janela)Clique para compartilhar no Facebook(abre em nova janela) Relacionado 26 de setembro de 2024